InP Wafer & EPI Wafer Market – Photonic & RF
نویسندگان
چکیده
منابع مشابه
Wafer-Level Packaging For RF Passive Integration
Wafer-level packaging (WLP) technology offers novel opportunities for the realisation of highquality on-chip passives needed in RF front-ends. IMEC proposes thin-film WLP technology in combination with 90nm CMOS as a cost-effective approach to integrate RF and microwave systems. The potential of this technology is assessed by means of two demonstrator sub-circuits: a low-power voltage-controlle...
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The silicon (Si) photonics platform has emerged as a promising integration platform for use in many applications, particularly datacenter communications, which is expected to produce demand for large numbers of low cost photonic integrated circuits (PICs). Sibased PICs are almost universally based on Si-on-insulator (SOI) wafers, which are enabled by wafer bonding technology. Si is useful as a ...
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Wafer-to-wafer bonding processes for microstructure fabrication are categorized and described. These processes have an impact in packaging and structure design. Processes are categorized into direct bonds, anodic bonds, and bonds with intermediate layers. Representative devices using wafer-to-wafer bonding are presented. Processes and methods for characterization of a range of bonding methods a...
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In RF-MEMS packaging, next to the protection of movable structures, optimization of package electrical performance plays a very important role. In this work, a wafer-level packaging process has been investigated and optimized in order to minimize electrical parasitic effects. The package concept used is based on a wafer-level bonding of a capping silicon substrate with throughsubstrate intercon...
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Why RF test on-wafer? Introduction The ever-increasing demand for more bandwidth to support the exploding Internet and the insatiable need for PCS (personal communication systems)/cellular devices has driven manufacturers of high speed digital and RF devices to push RF test of these devices upstream to the wafer level for a variety of reasons. Internet user demand for bandwidth is doubling ever...
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ژورنال
عنوان ژورنال: Photonics Russia
سال: 2019
ISSN: 1993-7296
DOI: 10.22184/fros.2019.13.2.214.217